Loading…
View analytic
Wednesday, March 21 • 1:00pm - 1:45pm
OCP NIC 3.0 Collaboration- An Open Hardware Development Story (Joint session with Server)

Sign up or log in to save this to your schedule and see who's attending!

Feedback form is now closed.
The OCP NIC subgroup has been working on this initiative since last summit. The goal is to explore and enable next generation open form factor, targeting NIC applications. The subgroup made great progress with strong involvement from system suppliers, NIC suppliers, connector suppliers, and end users. In this session we will update the latest status and outlook around this effort to broader community. We hope more community members are able to see benefit, give feedback, and join this effort in the future.

Speakers
JH

Joshua Held

Facebook
avatar for Yueming Li

Yueming Li

Thermal Engineer, Facebook
avatar for Jia Ning

Jia Ning

Facebook


Wednesday March 21, 2018 1:00pm - 1:45pm
210 E

Attendees (9)