The OCP NIC subgroup has been working on this initiative since last summit. The goal is to explore and enable next generation open form factor, targeting NIC applications. The subgroup made great progress with strong involvement from system suppliers, NIC suppliers, connector suppliers, and end users. In this session we will update the latest status and outlook around this effort to broader community. We hope more community members are able to see benefit, give feedback, and join this effort in the future.
